Description
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Intelligent HeatingThe machine adopts highly effective infrared components and advanced PID intelligent temperature control heating technology for accurate temperature control. |
Large Working AreaThe working bench size is 11 x 10.6 in / 280 x 270 mm, and it has a 1500 W heating system. |
Efficient Cooling SystemThe excellent cooling system can effectively prevent the machine from overheating while allowing long time work. |
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Clear Operation PanelThe user-friendly operation interface makes the BGA soldering machine practical and easily operated so that you can handle it through easy training. |
Compact & Light-WeightedThe machine is compact and light. With small footprints, it can be easily bench positioned, transported, or stored. |
Wide ApplicationThe IR preheating oven is suitable for heating lead / lead-free PCB board and components, especially suitable for BGA, the SMD element PCB board. |
Specifications
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